Bordelesa® 20 SC: Agrology’s Global Innovation

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  • It creates a protective film on the plant surface.
  • It gradually releases copper ions (Cu²⁺), which destroy the pathogen cells and inhibit spore germination.
  • It strengthens plant tissues, preventing pathogen entry through wounds caused by frost, hail, pruning, or mechanical damage.
  • Unique stability and uniformity without sedimentation
  • Ideal particle size and improved coverage
  • Rainfastness and longer residual activity
  • Safer and easier application

👉 Learn more about Bordelesa® 20 SC